IBM Inventors Receive Record-Breaking 8,000+ U.S. Patents in 2016

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IBM inventors received a record-breaking 8,088 U.S. patents during 2016, the company’s 24th

IBM inventors received a record-breaking 8,088 U.S. patents during 2016, the company’s 24th consecutive year of patent leadership. IBM’s 2016 patent output features more than 2,700 patents for inventions related to AI, cognitive computing and cloud computing, as well as thousands of patent inventions in cybersecurity, analytics and other areas. Master Inventor Yu Deng (pictured) was a co-inventor on five of the patents granted to IBM in 2016, including the milestone 8,000th patent granted on December 27 (US Patent #9,529,893) for an invention designed to search and analyze pictures, videos and other content shared on social media. (Credit: Michael Pollio/Feature Photo Service for IBM)

IBM inventors received a record-breaking 8,088 U.S. patents during 2016, the company’s 24th

IBM inventors received a record-breaking 8,088 U.S. patents during 2016, the company’s 24th consecutive year of patent leadership. IBM’s 2016 patent output features more than 2,700 patents for inventions related to AI, cognitive computing and cloud computing, as well as thousands of patent inventions in cybersecurity, analytics and other areas. Master Inventor Ruchi Mahindru (pictured) was a co-inventor on seven patents granted to IBM in 2016 including US Patent# 9,325,703 for an invention related to system security. (Credit: Michael Pollio/Feature Photo Service for IBM)

IBM inventors received a record-breaking 8,088 U.S. patents during 2016, the company’s 24th consecutive year of patent leadership.

IBM inventors received a record-breaking 8,088 U.S. patents during 2016, the company’s 24th consecutive year of patent leadership. IBM’s 2016 patent output features more than 2,700 patents for inventions related to AI, cognitive computing and cloud computing, as well as thousands of patent inventions in cybersecurity, analytics and other areas. Pictured is Master Inventor Emily Kinser, a co-inventor on three patents granted to IBM in 2016, with a next-generation 3D nanostructure shown at 100,000x magnification, inspired by US Patent #9,406,561, an invention that enables computer chips stacked on top of each other directly with no interface or space in between, a process referred to as “3D Integration.” (Credit: Michael Pollio/Feature Photo Service for IBM)

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